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Introduction of parameters of semi-automatic high speed COG press

Author:admin Time:2017-06-10

 Equipment use:
Applies to IC bonding to LCD already attached to ACF
半自动高速COG预压机
Semi automatic high speed COG press
Technical parameter:
Semi automatic high speed COG press
Size range 1~7"
Adhesion accuracy + 2.5 m
IC size L:2~40mm, W:0.8~3mm
Capacity 1000pcs/H
Power single phase 220V, power 1000W
Outline dimensions W:1100, D:960, H:1650
Equipment features:
= suitable arrangements for mass production
= constant temperature heating system, the PLC control system
Te vision system using original Panasonic processing system
= use imported electrical configuration
The original Japanese town of high precision CCD automatic alignment system

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