Semi automatic medium speed COG press is suitable for attaching IC on Panel, Bonding again, so as to achieve the equipment of IC and Panel corresponding circuit

Semi automatic medium speed COG press

Technical parameter:

Semi automatic medium speed COG press

Size range 1~7"

Adhesion accuracy + 4.5 m

IC size L:2~40mm, W:0.8~3mm

Attached number 1

Capacity 700pcs/H

Power single-phase 220V, 50HZ, power 1500W

Outline dimensions W:850, D:600, H:13800

Equipment features:

Te sent under the PLC control system

The town of precision low friction cylinder pressure control, ensure the accuracy of pressure control

Setting = high steel structure, double head ceramic preparation, to ensure the stability of the equipment

PID = constant temperature heating control, automatic temperature compensation, to ensure the stability of the hot pressing temperature