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Introduction of COG bonding machine

Author:admin Time:2017-06-02

 Introduction of COG bonding machine
COG machine is the device of accurate positioning of IC chip in LCD glass and binding machine, composed of PLC+HMI control core, image automatic alignment system PV310 data object alignment calculation, products in complete alignment and after preloading by platform transfer to the pressure of binding crimping. Adopt PLC control system, platform servo drive location, constant temperature heating mode, with stainless steel hot pressing head, realize constant temperature crimping. Lower counterpoint is used to press IC. Product MK points clear, automatic alignment. The equipment parameters are set according to the product requirements, and the equipment is automatically executed according to the specifications.
Main application: it is suitable for crimping of 10~26 inch LCD glass and IC.
Some parameters of COG bonding machine:
1. heating mode, constant temperature heating
2. temperature setting range, room temperature ~ 450 degrees Celsius (each set Step 1 degrees Celsius)
3. temperature accuracy + 8
4. set time 0.1 ~ 99.9 seconds
5. pressure range Min0.2 ~ Max 0.8MPa
6., workpiece fixed mode, right angle limit + vacuum adsorption
7. feeding way platform type
8. working mode can choose manual production and automatic production mode
9. manual mode: step by step through HMI step operation.
10. auto mode: press the double start button to run automatically to the end.
Buy a cog machine to the Europa League automation, we have 9 years experience in equipment, mainly to do mobile phone screen, touch screen, LCD module LCM/TP equipment research and development / production / sales / service as one of the manufacturers, the company's flagship product, ACF attached FOG COG machine, hot press, pre press, the press and COG LCM/TP module, peripheral equipment, accessories and consumables etc..

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